The NorCom 2020 provides automated in line, full matrix leak testing of hermetically sealed microelectronic and optoelectronic devices. It eliminates the need for helium mass spectroscopy and gross leak bubble testing by utilizing a patented laser interferometer to simultaneously measure gross and fine leaks in hermetic devices.

Since the reliability of hermetic electronic packages is dependent on the detection of gross and fine leaks, the NorCom 2020’s pinpoint accuracy, repeatability and increased production throughput make the system an essential requirement for hermetic device production.

Key Features

• High Throughput
• Automatic In-line Leak Detection
• Clean and Safe Procedure

The NorCom 2020-WL inspects MEMS and other wafer level devices for both gross and fine leaks simultaneously while automatically rejecting all leaking devices. The system accepts up to an eight inch wafer that can be optionally loaded into the machine on saw frames measuring up to eleven inches square.  The equipment is easy to setup and use, and the results can be networked to an SPC system for tracking all devices tested. It is ideal for leak testing any wafer level device that has an internal cavity. The system can inspect up to 1000 devices per cycle in both the singulated and un-singulated states.

The EV Series automated fluid dispensing system is a tabletop robot that offers easy automation for precise fluid applications, featuring proprietary dispensing software and a simple vision pencil camera.   The EV Series can function as a standalone system or as a key component in an automated solution. It integrates easily into in-line transfer systems, rotary tables, and pallet assembly lines.  

• Precision Fluid Dispensing:

Uses EFD syringe barrel and valve systems with vision-guided DispenseMotion™ software and a pencil camera for easy setup and programming.

• Advanced Motion Control:

True three-dimensional motion control for dots, lines, circles, arcs, and compound arcs.

• Versatile Platforms:

Platform sizes from 150 x 200 mm to 570 x 500 mm, suitable for batching and critical dispensing applications.

HPx High-Pressure Dispensing Tool easily apply precise amounts of thick assembly fluids like epoxies and medical-grade adhesives through dispense tips as small as 0.004” with Nordson EFD HPx™ dispensing tools. Featuring a unique design, HPx tools increase the pressure inside disposable syringe barrels up to seven times. Designed to work with Nordson EFD air-powered dispensers, they produce a maximum dispensing pressure of 700 psi. Increase yields and produce better quality parts in less time, while minimizing the risk of repetitive stress injuries.

Next-generation and time-tested capabilities are combined in this upgraded system to increase productivity by up to 50% over the top-selling Spectrum® ll, all in a space-saving footprint. Improve UPH with swift acceleration, enhanced motion control, and IntelliJet® compatible Forte MAX dual-valve dispensing.

SPHERE series systems support automated handling and processing of round or square wafer/substrate sizes ranging from 75mm to 300mm. In addition, thin wafer processing with or without carriers is possible, depending upon wafer thickness.

The patented plasma chamber design provides exceptional etch uniformity and process repeatability. Primary plasma applications include a variety of etching, ashing, and descum steps. Other plasma processes include contamination removal, surface roughening, increasing wettability, and enhancing bonding and adhesion strength, photoresist/polymer stripping, dielectric etch, wafer bumping, organic contamination removal, and wafer destress.

• Wafer Cleaning – The SPHERE series plasma systems remove contamination prior to wafer bumping, remove organic contamination, remove fluorine and other halogen contamination, and remove metal and metal oxides. Plasma also improves spun-on film adhesion and cleans metallic bond pads.
• Wafer Etching – Plasma systems descum wafer of residual photoresist and BCB, pattern dielectric layers for redistribution, strip/etch photoresist, enhance adhesion of wafer applied materials, remove excess wafer applied mold /epoxy, enhance adhesion of gold solder bumps, destress wafer to reduce breakage, improve spun-on film adhesion, and clean aluminum bond pads.

AP series plasma treatment machines are suitable for a wide variety of plasma cleaning, surface activation and adhesion improvement applications. These capabilities are used for semiconductor manufacturing, microelectronic packaging and assembly, and by manufacturers of medical and life science devices. The AP Series consists of four batch plasma treatment systems offering small, mid-size and large vacuum chamber options that deliver process correlation, controller continuity and reliable, reproducible vacuum gas plasma treatment to customers as they expand from an R&D environment to various levels of production.

Bare Board Loader With Pass Through Mode is used for loading of bare PCBs to the production line.

This unit is used for loading of substrates, leadframes or carriers.

Nutek – Laser Marking Cell Series 3 unit is used to mark text, barcode, 2D code & graphic onto PCBs.

Nutek – Laser Marking Cell Series 5 unit is used to mark text, barcode, 2D code & graphic onto PCBs.

The Multi Function Cage-type Buffer offers multiple functions, making it adaptable to diverse manufacturing environments. It efficiently manages product flow, optimizes space utilization, and minimizes the risk of damage during transit. The buffer system’s intelligent control system ensures smooth and synchronized operations, reducing bottlenecks and enhancing overall productivity.

The NTA In-line Workstation is used to link between SMD machines or board handling units. It also allows manual assembly work to be carried out.

This unit is used to invert PCBs (180°) for “double-sided” process.