The Hoya EXECURE 4000-D is a premium UV filter designed to provide exceptional clarity and protection for your camera lens. Its advanced multi-coating technology minimizes reflection and flare while maintaining high light transmission, resulting in sharp and vibrant images. With its scratch-resistant surface and water-repellent coating, the Hoya EXECURE 4000-D is the perfect choice for professional photographers and enthusiasts alike who demand the best performance from their equipment.

The Kardex Miniload-in-a-Box* is part of the product family Vertical Buffer Module (VBM) and provides solutions for fast-growing product ranges with limited storage space. The system uses a lightweight mini-load crane with a telescopic gripper to individually transport bins or trays to the access opening point.

The Kardex Compact Buffer is a Vertical Buffer Module (VBM) that provides an efficient solution for fast-growing product ranges with limited storage space.

This scalable bin solution works as a mini-load system and flexibly stores, picks and buffers small parts. With the recently launched version, capable of extending up to 20 meters, the Kardex Compact Buffer provides valuable benefits. It allows companies to maximize space by utilizing the storage area at a minimal cost.

Pick small parts quickly and efficiently with the Kardex Compact Buffer (formerly LR 35)

To optimize order picking performance for small parts and lightweight goods, the Kardex Compact Buffer (formerly LR 35) is the ideal solution. Whether being used to supply a production line with a wide range of products; as buffer storage in the assembly area; or for picking slow-moving parts in the distribution warehouse, the Kardex Compact Buffer (formerly LR 35) significantly improves productivity, while guaranteeing accuracy and energy efficiency.

It is flexible and scalable. A work station can consist of one or more units. Companies benefit from optimal storage capacity and performance. They choose from several access opening types and can customize the unit dimensions up to 20 meters long and 12 meters high. This flexibility makes the Kardex Compact Buffer (formerly LR 35) an ideal solution for multiple applications. It easily integrates into existing processes and connects to different customer host-systems.

The importance of ergonomic picking is growing. Customers working with the Kardex Compact Buffer (formerly LR 35) benefit from ergonomic work stations, which simplify the picking process and improve overall working conditions. At each access opening, items tilt at a 20-degree angle while the goods-to-person principle delivers items directly to the operator, eliminating walk and search time.

The NorCom 2020 provides automated in line, full matrix leak testing of hermetically sealed microelectronic and optoelectronic devices. It eliminates the need for helium mass spectroscopy and gross leak bubble testing by utilizing a patented laser interferometer to simultaneously measure gross and fine leaks in hermetic devices.

Since the reliability of hermetic electronic packages is dependent on the detection of gross and fine leaks, the NorCom 2020’s pinpoint accuracy, repeatability and increased production throughput make the system an essential requirement for hermetic device production.

Key Features

• High Throughput
• Automatic In-line Leak Detection
• Clean and Safe Procedure

HPx High-Pressure Dispensing Tool easily apply precise amounts of thick assembly fluids like epoxies and medical-grade adhesives through dispense tips as small as 0.004” with Nordson EFD HPx™ dispensing tools. Featuring a unique design, HPx tools increase the pressure inside disposable syringe barrels up to seven times. Designed to work with Nordson EFD air-powered dispensers, they produce a maximum dispensing pressure of 700 psi. Increase yields and produce better quality parts in less time, while minimizing the risk of repetitive stress injuries.

SPHERE series systems support automated handling and processing of round or square wafer/substrate sizes ranging from 75mm to 300mm. In addition, thin wafer processing with or without carriers is possible, depending upon wafer thickness.

The patented plasma chamber design provides exceptional etch uniformity and process repeatability. Primary plasma applications include a variety of etching, ashing, and descum steps. Other plasma processes include contamination removal, surface roughening, increasing wettability, and enhancing bonding and adhesion strength, photoresist/polymer stripping, dielectric etch, wafer bumping, organic contamination removal, and wafer destress.

• Wafer Cleaning – The SPHERE series plasma systems remove contamination prior to wafer bumping, remove organic contamination, remove fluorine and other halogen contamination, and remove metal and metal oxides. Plasma also improves spun-on film adhesion and cleans metallic bond pads.
• Wafer Etching – Plasma systems descum wafer of residual photoresist and BCB, pattern dielectric layers for redistribution, strip/etch photoresist, enhance adhesion of wafer applied materials, remove excess wafer applied mold /epoxy, enhance adhesion of gold solder bumps, destress wafer to reduce breakage, improve spun-on film adhesion, and clean aluminum bond pads.

This unit is used for loading of substrates, leadframes or carriers.